{"id":73,"date":"2018-09-26T17:26:40","date_gmt":"2018-09-26T08:26:40","guid":{"rendered":"http:\/\/150.60.213.156\/en\/wordpress\/?page_id=73"},"modified":"2020-07-17T18:03:40","modified_gmt":"2020-07-17T09:03:40","slug":"product","status":"publish","type":"page","link":"https:\/\/www.optima-1.co.jp\/en\/product\/","title":{"rendered":"Product description"},"content":{"rendered":"<div class=\"is_product_information\">\n<div class=\"items box01\">\n<h3 class=\"md_box_title\">Product description<\/h3>\n<p class=\"summary\">&nbsp;<\/p>\n<div class=\"inner\">\n<div class=\"cot\" id=\"num01\">\n<p class=\"photo\"><img decoding=\"async\" src=\"\/wordpress\/wp-content\/themes\/optima\/assets\/images\/product\/photo01.png\" alt=\"Wafer Edge Inspection System\"><\/p>\n<dl>\n<dt>Wafer Edge Inspection System<span class=\"mini\">RXW-1200<\/span><\/dt>\n<dd>The automatic inspection equipment to detect and classify wafer edge defects as well as to measure the size of required parts in the Si wafer or device manufacturing process<\/p>\n<p class=\"adds\"><span class=\"bold\">Semiconductor Manufacturing Process<\/span><br \/>\n            Edge Grinding \/ Single Side Grinding \/ Double Side Polishing \/ Cleaning \/ Drying \/ Prime Wafer Final Inspection \/ Epitaxy, Silicon on Insulator \/ Deposition \/ Lithography \/ CMP \/ Edge Trimming \/ Pasting \/ Thinning<\/p>\n<\/dd>\n<\/dl><\/div>\n<\/p><\/div>\n<div class=\"inner\">\n<div class=\"cot\" id=\"num02\">\n<p class=\"photo\"><img decoding=\"async\" src=\"\/wordpress\/wp-content\/themes\/optima\/assets\/images\/product\/photo02.png\" alt=\"Backside Macro Wafer Inspection System\"><\/p>\n<dl>\n<dt>Backside Macro Wafer Inspection System<span class=\"mini\">BMW-1200<\/span><\/dt>\n<dd>The inspection equipment with high sensitive detection of deficiency \/ contamination of wafer back side and with three-dimensional sharp measurement of extracted defects in device manufacturing process<\/p>\n<p class=\"adds\"><span class=\"bold\">Semiconductor Manufacturing Process<\/span><br \/>\n            Deposition \/ Lithography \/ Etching \/ CMP<\/p>\n<\/dd>\n<\/dl><\/div>\n<\/p><\/div>\n<div class=\"inner\">\n<div class=\"cot\" id=\"num03\">\n<p class=\"photo\"><img decoding=\"async\" src=\"\/wordpress\/wp-content\/themes\/optima\/assets\/images\/product\/photo03.png\" alt=\"Edge and front \/ back surface Inspection Equipment\"><\/p>\n<dl>\n<dt>Edge and Front \/ Back Surface Inspection Equipment<span class=\"mini\">RXM-1200<\/span><\/dt>\n<dd>The inspection equipment to detect various kinds of deficiency of Wafer edge \/ both sides which occur is Si wafer manufacturing (Polishing \/ Epi) process<\/p>\n<p class=\"adds\"><span class=\"bold\">Semiconductor Manufacturing Process<\/span><br \/>\n            Edge Griding \/ Single Side Grinding \/ Double Side Polishing \/ Cleaning \/ Drying \/ Prime Wafer Final Inspection \/ Epitaxy, Silicon on Insulator<\/p>\n<\/dd>\n<\/dl><\/div>\n<\/p><\/div>\n<div class=\"inner\">\n<div class=\"cot\" id=\"num04\">\n<p class=\"photo\"><img decoding=\"async\" src=\"\/wordpress\/wp-content\/themes\/optima\/assets\/images\/product\/photo04.png\" alt=\"Pinhole Defect Inspection Equipment\"><\/p>\n<dl>\n<dt>Pinhole Defect Inspection Equipment<span class=\"mini\">RXP-1200<\/span><\/dt>\n<dd>The automatic inspection equipment to detect pinhole defects using infrared light in the inside or on the back surface which occur in the Si crystal growth process<\/p>\n<p class=\"adds\"><span class=\"bold\">Semiconductor Manufacturing Process<\/span><br \/>\n            Crystal Growth \/ Slicing \/ Single Side Grinding \/ Double Side Polishing \/ Prime Wafer Final Inspection<\/p>\n<\/dd>\n<\/dl><\/div>\n<\/p><\/div>\n<div class=\"inner\" style=\"display:none;\">\n<div class=\"cot\" id=\"num05\">\n<p class=\"photo\"><img decoding=\"async\" src=\"\/wordpress\/wp-content\/themes\/optima\/assets\/images\/product\/photo05.png\" alt=\"Silicon Crystal Deficiency Inspection Equipment\"><\/p>\n<dl>\n<dt>Silicon Crystal Deficiency Inspection Equipment BMD Analyzer MO-441 M2<span class=\"mini\">BMD Analyzer MO-441 M2<br \/>BMD Analyzer MO-471<br \/>BMD Analyzer MO-461 M2<\/span><\/dt>\n<dd>The inspection equipment with high sensitive measurement of crystal deficiency density in the Si wafer, important to the manufacturing advanced device<\/p>\n<p class=\"adds\"><span class=\"bold\">Semiconductor Manufacturing Process<\/span><br \/>\n            Crystal Growth \/ Slicing \/ Double Side Polishing<\/p>\n<\/dd>\n<dd class=\"md_pdf_btn\">\n<aside>\u203bAs for the MO series, it was transferred business from September 1,<br \/>2018 to System Seiko Co., Ltd of group businesses.<\/aside>\n<p>          <a target=\"_blank\" href=\"http:\/\/www.systemseiko.co.jp\/\" rel=\"noopener noreferrer\">Link<\/a><\/dd>\n<\/dl><\/div>\n<\/p><\/div>\n<div class=\"inner\" style=\"display:none;\">\n<div class=\"cot\" id=\"num06\">\n<p class=\"photo\"><img decoding=\"async\" src=\"\/wordpress\/wp-content\/themes\/optima\/assets\/images\/product\/photo06.png\" alt=\"LSTD Scanner\"><\/p>\n<dl>\n<dt>LSTD Scanner MO-601HS M2<\/dt>\n<dd>The nondestructive inspection equipment to detect distributed defects of wafer surface on device active layer using laser light scattering and image measuring<\/p>\n<p class=\"adds\"><span class=\"bold\">Semiconductor Manufacturing Process<\/span><br \/>\n            Crystal Growth \/ Slicing \/ Double Side Polishing \/ Prime Wafer Final Inspection<\/p>\n<\/dd>\n<dd class=\"md_pdf_btn\">\n<aside>\u203bAs for the MO series, it was transferred business from September 1,<br \/>2018 to System Seiko Co., Ltd of group businesses.<\/aside>\n<p>          <a target=\"_blank\" href=\"http:\/\/www.systemseiko.co.jp\/\" rel=\"noopener noreferrer\">Link<\/a><\/dd>\n<\/dl><\/div>\n<\/p><\/div>\n<\/p><\/div>\n<div class=\"items box02\">\n<p class=\"summary\">Please inform it of the question about the product then &#8220;inquiry&#8221;.<\/p>\n<div class=\"inner\">\n<div class=\"cot\">\n<p class=\"md_btn_commons\"><a href=\"\/contact\/\">inquiry<\/a><\/p>\n<\/p><\/div>\n<\/p><\/div>\n<\/p><\/div>\n<\/div>\n","protected":false},"excerpt":{"rendered":"<p>Product description &nbsp; Wafer Edge Inspection SystemRXW-1200 The automatic inspection equipment to detect a &hellip; <\/p>\n<p class=\"link-more\"><a href=\"https:\/\/www.optima-1.co.jp\/en\/product\/\" class=\"more-link\"><span class=\"screen-reader-text\">&#8220;Product description&#8221; \u306e<\/span>\u7d9a\u304d\u3092\u8aad\u3080<\/a><\/p>\n","protected":false},"author":1,"featured_media":74,"parent":0,"menu_order":30,"comment_status":"closed","ping_status":"closed","template":"","meta":[],"_links":{"self":[{"href":"https:\/\/www.optima-1.co.jp\/en\/wp-json\/wp\/v2\/pages\/73"}],"collection":[{"href":"https:\/\/www.optima-1.co.jp\/en\/wp-json\/wp\/v2\/pages"}],"about":[{"href":"https:\/\/www.optima-1.co.jp\/en\/wp-json\/wp\/v2\/types\/page"}],"author":[{"embeddable":true,"href":"https:\/\/www.optima-1.co.jp\/en\/wp-json\/wp\/v2\/users\/1"}],"replies":[{"embeddable":true,"href":"https:\/\/www.optima-1.co.jp\/en\/wp-json\/wp\/v2\/comments?post=73"}],"version-history":[{"count":25,"href":"https:\/\/www.optima-1.co.jp\/en\/wp-json\/wp\/v2\/pages\/73\/revisions"}],"predecessor-version":[{"id":207,"href":"https:\/\/www.optima-1.co.jp\/en\/wp-json\/wp\/v2\/pages\/73\/revisions\/207"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/www.optima-1.co.jp\/en\/wp-json\/wp\/v2\/media\/74"}],"wp:attachment":[{"href":"https:\/\/www.optima-1.co.jp\/en\/wp-json\/wp\/v2\/media?parent=73"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}